Electronic components are becoming smaller and more complex.

High-resolution, high-magnification X-ray and computed tomography examinations support development, series monitoring and failure analysis. The X-ray images make production problems and material defects visible.

GWP is your contact for inspection tasks such as:

• Inspection of bonding wires and bonding surfaces
• Inspection of solder joints
• Analysis of SMD components, capacitors and coils
• Cavity analysis of conductive and non-conductive chip bonding compounds
• Analysis of printed circuit boards (Assembled Printed Circuit Boards - PCB)
• Analysis of missing solder joints, voids, solder bridges
• Characterization of sensors, electromechanical packages
• Analysis of connectors and crimps
• Examination of batteries and battery packs